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  2. Wallace tree - Wikipedia

    en.wikipedia.org/wiki/Wallace_tree

    4 layer Wallace reduction of an 8x8 partial product matrix, using 15 half adders (two dots) and 38 full adders (three dots). The dots in each column are bits of equal weight. A Wallace multiplier is a hardware implementation of a binary multiplier, a digital circuit that multiplies two integers.

  3. Dadda multiplier - Wikipedia

    en.wikipedia.org/wiki/Dadda_multiplier

    4 layer Dadda reduction of an 8x8 partial product matrix, using 7 half adders (two dots) and 35 full adders (three dots). The dots in each column are bits of equal weight. Bits with lower weight are rightmost. The example in the adjacent image illustrates the reduction of an 8 × 8 multiplier, explained here.

  4. Layers of protection analysis - Wikipedia

    en.wikipedia.org/wiki/Layers_of_protection_analysis

    Layers of protection analysis (LOPA) is a technique for evaluating the hazards, risks and layers of protection associated with a system, such as a chemical process plant. . In terms of complexity and rigour LOPA lies between qualitative techniques such as hazard and operability studies (HAZOP) and quantitative techniques such as fault trees and event trees.

  5. Viscoplasticity - Wikipedia

    en.wikipedia.org/wiki/Viscoplasticity

    the Mechanical threshold stress model. the Preston–Tonks–Wallace model. The Johnson–Cook (JC) model [24] is purely empirical and is the most widely used of the five. However, this model exhibits an unrealistically small strain-rate dependence at high temperatures. The Steinberg–Cochran–Guinan–Lund (SCGL) model [25] [26] is semi ...

  6. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]

  7. Silicon controlled rectifier - Wikipedia

    en.wikipedia.org/wiki/Silicon_controlled_rectifier

    The principle of four-layer p–n–p–n switching was developed by Moll, Tanenbaum, Goldey, and Holonyak of Bell Laboratories in 1956. [1] The practical demonstration of silicon controlled switching and detailed theoretical behavior of a device in agreement with the experimental results was presented by Dr Ian M. Mackintosh of Bell ...

  8. Minimum message length - Wikipedia

    en.wikipedia.org/wiki/Minimum_message_length

    Minimum message length (MML) is a Bayesian information-theoretic method for statistical model comparison and selection. [1] It provides a formal information theory restatement of Occam's Razor: even when models are equal in their measure of fit-accuracy to the observed data, the one generating the most concise explanation of data is more likely to be correct (where the explanation consists of ...

  9. List of mnemonics - Wikipedia

    en.wikipedia.org/wiki/List_of_mnemonics

    For the OSI Network Layer model Please Do Not Throw Sausage Pizza Away correspond to the Physical, Datalink, Network, Transport, Session, Presentation and Application layers. For power in watts: Twinkle twinkle little star, Power equals I (current) squared R (resistance). "ELI the ICE man": E leads the I in an inductor, I leads the E in a ...