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The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.
Both wafers and reticles can be handled by SMIF pods in a semiconductor fabrication environment. Used in lithographic tools, reticles or photomasks contain the image that is exposed on a coated wafer in one processing step of a complete integrated semiconductor manufacturing cycle. Because reticles are linked so directly with wafer processing ...
ACM Research, Inc. (ACMR) is a publicly traded American semiconductor company that engages in the manufacture and sale of single-wafer wet cleaning equipment used to improve product yield. Although based in the U.S., the majority of the company's business is done in China through its subsidiary, ACM Research (Shanghai).
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. [2] Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects).
Etching is a critically important process module in fabrication, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography.
The ceilings of semiconductor cleanrooms have fan filter units (FFUs) at regular intervals to constantly replace and filter the air in the cleanroom; semiconductor capital equipment may also have their own FFUs to clean air in the equipment's EFEM which allows the equipment to receive wafers in FOUPs. The FFUs, combined with raised floors with ...
Illustration of FEOL (device generation in the silicon, bottom) and BEOL (depositing metalization layers, middle part) to connect the devices. CMOS fabrication process. The front end of line (FEOL) is the first portion of IC fabrication where the individual components (transistors, capacitors, resistors, etc.) are patterned in a semiconductor substrate. [1]
It supplies process control and yield management systems for the semiconductor industry and other related nanoelectronics industries. The company's products and services are intended for all phases of wafer , reticle , integrated circuit (IC) and packaging production, from research and development to final volume manufacturing.