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  2. Rapid single flux quantum - Wikipedia

    en.wikipedia.org/wiki/Rapid_single_flux_quantum

    In electronics, rapid single flux quantum (RSFQ) is a digital electronic device that uses superconducting devices, namely Josephson junctions, to process digital signals.In RSFQ logic, information is stored in the form of magnetic flux quanta and transferred in the form of Single Flux Quantum (SFQ) voltage pulses.

  3. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Small-outline integrated circuit: Also known as SOIC NARROW and SOIC WIDE: SOJ: Small-outline J-leaded package SON Small-outline no-lead package SSOP: Shrink small-outline package [3] TSOP: Thin small-outline package [3] TSSOP: Thin shrink small-outline package [3] TVSOP: Thin very-small-outline package [3] VSOP Very-small-outline package [15 ...

  4. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology, one of several package technologies that connect ICs to the surfaces of PCBs without through-holes. Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate.

  5. TO-3 - Wikipedia

    en.wikipedia.org/wiki/TO-3

    The case is used with high-power and high-current devices, on the order of a few tens of amperes current and up to a hundred watts of heat dissipation. The case surfaces are metal for good heat conductivity and durability. The metal-to-metal and metal-to-glass joints provide hermetic seals that protect the semiconductor from liquids and gases.

  6. Electronic packaging - Wikipedia

    en.wikipedia.org/wiki/Electronic_packaging

    Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly. Examples are injection molding, transfer molding, vacuum forming, and die cutting. Pl can be post-processed to provide conductive surfaces.

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