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  2. Pad printing - Wikipedia

    en.wikipedia.org/wiki/Pad_printing

    Pad printing (also called tampography) is a printing process that can transfer a 2-D image onto a 3-D object (e.g., a ceramic pottery).This is accomplished using an indirect offset printing process that involves an image being transferred from the cliché via a silicone pad onto a substrate.

  3. Silicone rubber - Wikipedia

    en.wikipedia.org/wiki/Silicone_rubber

    In its uncured state, silicone rubber is a highly adhesive gel or liquid. To convert it to a solid, it must be cured, vulcanized, or catalyzed.This is normally carried out in a two-stage process at the point of manufacture into the desired shape, and then in a prolonged post-cure process.

  4. Silicone - Wikipedia

    en.wikipedia.org/wiki/Silicone

    Silicone caulk can be used as a basic sealant against water and air penetration. In organosilicon and polymer chemistry, a silicone or polysiloxane is a polymer composed of repeating units of siloxane (−O−R 2 Si−O−SiR 2 −, where R = organic group). They are typically colorless oils or rubber-like substances. Silicones are used in ...

  5. Injection molding of liquid silicone rubber - Wikipedia

    en.wikipedia.org/wiki/Injection_molding_of...

    Injection molding of liquid silicone rubber (LSR) is a process to produce pliable, durable parts in high volume.. Liquid silicone rubber is a high purity platinum cured silicone with low compression set, good stability and ability to resist extreme temperatures of heat and cold ideally suitable for production of parts, where high quality is required.

  6. Plastisol - Wikipedia

    en.wikipedia.org/wiki/Plastisol

    Plastisol. A plastisol is a colloidal dispersion of small polymer particles, usually polyvinyl chloride (PVC), in a liquid plasticizer.When heated to around 180 °C (356 °F), the plastic particles absorb the plasticizer, causing them to swell and fuse together forming a viscous gel.

  7. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    Starting from the schematic diagram the component pin pads were laid out on the mylar and then traces were routed to connect the pads. Rub-on dry transfers of common component footprints increased efficiency. Traces were made with self-adhesive tape. Pre-printed non-reproducing grids on the mylar assisted in layout.