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Micrograph of a polycrystalline metal; grain boundaries evidenced by acid etching. Differently-oriented crystallites in a polycrystalline material. In materials science, a grain boundary is the interface between two grains, or crystallites, in a polycrystalline material.
This is also known as intercrystalline fracture or grain-boundary separation. More rapid diffusion along grain boundaries than along grain interiors; Faster nucleation and growth of precipitates at the grain boundaries; Quench cracking, or crack growth following a quenching process, is another example of intergranular fracture and almost always ...
Mishra et al. propose a slightly different explanation, in which the rotation is aided by diffusion along the grain boundaries (which is much faster than through the bulk). [27] F.A. Mohamad has proposed a model for the minimum grain size achievable using mechanical milling. The model is based on the concept that the grain size is dependent on ...
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature (above ~0.4 [1]) and low strain rate and is intertwined with creep.
Figure 1: Hall–Petch strengthening is limited by the size of dislocations. Once the grain size reaches about 10 nanometres (3.9 × 10 −7 in), grain boundaries start to slide. In materials science, grain-boundary strengthening (or Hall–Petch strengthening) is a method of strengthening materials by changing their average crystallite (grain
In metallurgy, materials science and structural geology, subgrain rotation recrystallization is recognized as an important mechanism for dynamic recrystallisation.It involves the rotation of initially low-angle sub-grain boundaries until the mismatch between the crystal lattices across the boundary is sufficient for them to be regarded as grain boundaries.
Plasticity in polycrystals differs substantially from that in single crystals due to the presence of grain boundary (GB) planar defects, which act as very strong obstacles to plastic flow by impeding dislocation migration along the entire length of the activated slip plane(s).
Nonmetallic impurities often aggregate at grain boundaries and have the ability to impact the strength of materials by changing the grain boundary energy. Rupert et al. [26] conducted first-principles simulations to study the impact of the addition of common nonmetallic impurities on Σ5 (310) grain boundary energy in Cu. They claimed that the ...