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Molecular model of sodium hypophosphite, the usual reducing agent in electroless nickel-phosphorus plating. The main ingredients of an electroless nickel plating bath are source of nickel cations Ni 2+, usually nickel sulfate and a suitable reducing agent, such as hypophosphite H 2 PO − 2 or borohydride BH − 4. [1]
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel-boron plating developed as a variant of the similar nickel-phosphorus process, discovered accidentally by Charles Adolphe Wurtz in 1844. [2]In 1969, Harold Edward Bellis from DuPont filed a patent for a general class of electroless plating processes using sodium borohydride, dimethylamine borane, or sodium hypophosphite, in the presence of thallium salts, thus producing a ...
Nickel electroplating is a process of depositing nickel onto a metal part. Parts to be plated must be clean and free of dirt, corrosion, and defects before plating can begin. [ 3 ] To clean and protect the part during the plating process, a combination of heat treating , cleaning, masking, pickling , and etching may be used. [ 1 ]
Since its introduction the pistol’s design and construction have undergone a number of improvements including slightly increased chamber dimensions and the use of a Teflon electroless nickel composite material for some of the internal moving parts which improved reliability. [5]
The electroless deposition process is defined by four steps: [2] [3] [21] Pretreatment or functionalization of the substrate cleans the surface of the substrate to remove any contaminants which affects nanoparticle size and poor plating occurs. Pretreatment determines the porosity of the elemental metal deposition, and the initiation site of ...