Search results
Results From The WOW.Com Content Network
Natural tantalum (73 Ta) consists of two stable isotopes: 181 Ta (99.988%) and 180m Ta (0.012%). There are also 35 known artificial radioisotopes, the longest-lived of which are 179 Ta with a half-life of 1.82 years, 182 Ta with a half-life of 114.43 days, 183 Ta with a half-life of 5.1 days, and 177 Ta with a half-life of 56.56 hours.
Tantalum is a chemical element; it has symbol Ta and atomic number 73. Previously known as tantalium , [ citation needed ] it is named after Tantalus , a figure in Greek mythology. [ 11 ] Tantalum is a very hard, ductile , lustrous , blue-gray transition metal that is highly corrosion-resistant.
This page was last edited on 16 November 2024, at 12:16 (UTC).; Text is available under the Creative Commons Attribution-ShareAlike 4.0 License; additional terms may apply.
Elastic properties describe the reversible deformation (elastic response) of a material to an applied stress.They are a subset of the material properties that provide a quantitative description of the characteristics of a material, like its strength.
More than 4 million people across five states were under winter storm alerts on Sunday as heavy lake-effect snow continued to bury the Great Lakes region, prompting emergency declarations and the ...
The tantalum–tungsten alloys are characterized by their high melting point and the tension resistance. The properties of the final alloy are a combination of properties from the two elements: tungsten, the element with the highest melting point in the periodic table, and tantalum which has high corrosion resistance. [1] [2]
1. Chocolate Fondue. Think of that fondue fountain at the buffet as Willy Wonka's sacred chocolate waterfall and river. The chocolate must go untouched by human hands, or it will be ruined.
Tantalum nitride (TaN) is a chemical compound, a nitride of tantalum.There are multiple phases of compounds, stoichimetrically from Ta 2 N to Ta 3 N 5, including TaN.. As a thin film TaN find use as a diffusion barrier and insulating layer between copper interconnects in the back end of line of computer chips.