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  2. CircuitMaker - Wikipedia

    en.wikipedia.org/wiki/CircuitMaker

    CircuitMaker is electronic design automation software for printed circuit board designs, for the hobby, hacker, and maker community. [1] [2] CircuitMaker is available as freeware, and the hardware designed with it may be used for commercial and non-commercial purposes without limitations. [3]

  3. Wire bonding - Wikipedia

    en.wikipedia.org/wiki/Wire_bonding

    Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common.

  4. List of free electronics circuit simulators - Wikipedia

    en.wikipedia.org/wiki/List_of_free_electronics...

    List of free analog and digital electronic circuit simulators, available for Windows, macOS, Linux, and comparing against UC Berkeley SPICE. The following table is split into two groups based on whether it has a graphical visual interface or not.

  5. Through-silicon via - Wikipedia

    en.wikipedia.org/wiki/Through-silicon_via

    A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically so that they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small "footprint".

  6. Copper interconnects - Wikipedia

    en.wikipedia.org/wiki/Copper_interconnects

    Copper interconnects are used in integrated circuits to reduce propagation delays and power consumption. Since copper is a better conductor than aluminium, ICs using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. Together, these effects lead to ICs with ...

  7. Via (electronics) - Wikipedia

    en.wikipedia.org/wiki/Via_(electronics)

    A via (Latin, 'path' or 'way') is an electrical connection between two or more metal layers of a printed circuit boards (PCB) or integrated circuit. Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal (often copper) that forms an electrical connection through the insulating layers.

  8. Thermosonic bonding - Wikipedia

    en.wikipedia.org/wiki/Thermosonic_bonding

    Thermosonic bonding is widely used to wire bond silicon integrated circuits into computers. Alexander Coucoulas was named "Father of Thermosonic Bonding" by George Harman, [1] the world's foremost authority on wire bonding, where he referenced Coucoulas's leading edge publications in his book, Wire Bonding In Microelectronics.

  9. Semiconductor device - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device

    A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in