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  2. Plasma etching - Wikipedia

    en.wikipedia.org/wiki/Plasma_etching

    Argon plasma etching has reported to enhance contact angle from 52 deg to 68 deg, [7] and, Oxygen plasma etching to reduce contact angle from 52 deg to 19 deg for CFRP composites for bone plate applications. Plasma etching has been reported to reduce the surface roughness from hundreds of nanometers to as much lower as 3 nm for metals. [8]

  3. Reactive-ion etching - Wikipedia

    en.wikipedia.org/wiki/Reactive-ion_etching

    Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure by an electromagnetic field.

  4. Etching (microfabrication) - Wikipedia

    en.wikipedia.org/wiki/Etching_(microfabrication)

    The use of the term anisotropy for plasma etching should not be conflated with the use of the same term when referring to orientation-dependent etching. The source gas for the plasma usually contains small molecules rich in chlorine or fluorine. For instance, carbon tetrachloride (CCl 4) etches silicon and aluminium, and trifluoromethane etches ...

  5. Deep reactive-ion etching - Wikipedia

    en.wikipedia.org/wiki/Deep_reactive-ion_etching

    DRIE of glass requires high plasma power, which makes it difficult to find suitable mask materials for truly deep etching. Polysilicon and nickel are used for 10–50 μm etched depths. In DRIE of polymers, Bosch process with alternating steps of SF 6 etching and C 4 F 8 passivation take place.

  6. Plasma cleaning - Wikipedia

    en.wikipedia.org/wiki/Plasma_cleaning

    Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. Gases such as argon and oxygen , as well as mixtures such as air and hydrogen/nitrogen are used.

  7. Inductively coupled plasma - Wikipedia

    en.wikipedia.org/wiki/Inductively_coupled_plasma

    Fig. 2. The construction of Inductively Coupled Plasma torch. [3] A: cooling gas tangential flow to the outer quartz tube B: discharge gas flow (usually Ar) C: flow of carrier gas with sample D: induction coil which forms the strong magnetic field inside the torch E: force vectors of the magnetic field F: the plasma torch (the discharge).

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    www.aol.com/being-flat-betting-10k-ai-193855260.html

    Financial Fundamentals: (all based on market statistics at the time of this writing) LAM Research has a $104 billion market cap, $15.6 billion in trailing revenues, $4.1 billion in earnings, and ...

  9. Category:Plasma processing - Wikipedia

    en.wikipedia.org/wiki/Category:Plasma_processing

    Pages in category "Plasma processing" The following 25 pages are in this category, out of 25 total. ... Plasma etching; Plasma gasification commercialization;