Ads
related to: sodimm 32gb ddr4 3200 hynix ssd 8gb price in n
Search results
Results From The WOW.Com Content Network
The 8n prefetch architecture is combined with an interface designed to transfer two data words per clock cycle at the I/O pins. A single read or write operation for the DDR4 SDRAM consists of a single 8n-bit-wide 4-clock data transfer at the internal DRAM core and 8 corresponding n-bit-wide half-clock-cycle data transfers at the I/O pins. [20]
A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
SK hynix [37] South Korea No Yes Yes No Yes (since 2012) [1] STEC [38] United States No No Yes No No Strontium Technology [39] Singapore: No No Yes No No Super Talent Technology [40] United States No No Yes No No Swissbit [41] Switzerland No No Yes No Yes, through its subsidiary Hyperstone TDK [42] Japan No No Yes No No Texas Memory Systems [43 ...
Assorted SO-DIMM Modules A 200-pin PC2-5300 DDR2 SO-DIMM. A 204-pin PC3-10600 DDR3 SO-DIMM. A SO-DIMM slot on a computer motherboard. A SO-DIMM (pronounced "so-dimm" / ˈ s oʊ d ɪ m /, also spelled "SODIMM") or small outline DIMM, is a smaller alternative to a DIMM, being roughly half the physical size of a regular DIMM. The first SODIMMs had ...
PC133 refers to SDR SDRAM operating at a clock frequency of 133 MHz, on a 64-bit-wide bus, at a voltage of 3.3 V. PC133 is available in 168-pin DIMM and 144-pin SO-DIMM form factors. PC133 is the fastest and final SDR SDRAM standard ever approved by the JEDEC, and delivers a bandwidth of 1.066 GB per second ([133.33 MHz * 64/8]=1.066 GB/s).
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs [1] and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers ...