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A 16GB [1] DDR4 SO-DIMM module by Micron. DDR4 memory is supplied in 288-pin dual in-line memory modules (DIMMs), similar in size to 240-pin DDR3 DIMMs. DDR4 RAM modules feature pins that are spaced more closely at 0.85 mm compared to the 1.0 mm spacing in DDR3, allowing for a higher pin density within the same standard DIMM length of 133.35 mm ...
Typically DIMM or SO-DIMM. ... DDR1 memory's prices substantially increased from Q2 2008, while DDR2 prices declined. ... DDR4-3200 400 2.5 1600 3200 25600 DDR5 DDR5-3200
SK hynix [37] South Korea No Yes Yes No Yes (since 2012) [1] STEC [38] United States No No Yes No No Strontium Technology [39] Singapore: No No Yes No No Super Talent Technology [40] United States No No Yes No No Swissbit [41] Switzerland No No Yes No Yes, through its subsidiary Hyperstone TDK [42] Japan No No Yes No No Texas Memory Systems [43 ...
PC133 refers to SDR SDRAM operating at a clock frequency of 133 MHz, on a 64-bit-wide bus, at a voltage of 3.3 V. PC133 is available in 168-pin DIMM and 144-pin SO-DIMM form factors. PC133 is the fastest and final SDR SDRAM standard ever approved by the JEDEC, and delivers a bandwidth of 1.066 GB per second ([133.33 MHz * 64/8]=1.066 GB/s).
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix.It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs [1] and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers ...
DDR4, 2 SODIMM 3200 64 GB Ultra DisplayPort 1.4 and Thunderbolt 4.0 over USB Type C Connector N/A 1 2230 M.2 PCIe 4 NVMe N/A 1x USB 4, 4x USB 3.2 Gen 2 (1x Type C) 7090 June 2021 Intel Q570: Intel Core i3, i5, i7, i9 (11th gen/Rocket lake) DMI 3.0 x8 DDR4, 2 SODIMM 3200 128 GB MT, SFF, Micro Pro 2