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In the semiconductor industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. The round shape characteristic of these wafers comes from single-crystal ingots usually produced using the Czochralski method. Silicon wafers were first introduced in the 1940s. [2] [3]
wafer-to-wafer (also wafer-on-wafer) stacking – bonding and integrating whole processed wafers atop one another before dicing the stack into dies wire bonding – using tiny wires to interconnect an IC or other semiconductor device with its package (see also thermocompression bonding, flip chip, hybrid bonding, etc.)
A compound semiconductor is a semiconductor compound composed of chemical elements of at least two different species. These semiconductors form for example in periodic table groups 13–15 (old groups III–V), for example of elements from the Boron group (old group III, boron, aluminium, gallium, indium) and from group 15 (old group V, nitrogen, phosphorus, arsenic, antimony, bismuth).
Ambarella Inc. announced the availability of the A7L system-on-a-chip circuit for digital still cameras, providing 1080p60 high-definition video capabilities in September 2011 [110] Chips using 24–28 nm technology
[55] [56] The semiconductor industry has adopted larger wafers to cope with the increased demand for chips as larger wafers provide more surface area per wafer. [57] Over time, the industry shifted to 300 mm wafers which brought along the adoption of FOUPs, [ 58 ] but many products that are not advanced are still produced in 200 mm wafers such ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
Outlines of some packaged semiconductor devices. A semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators.