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  2. Quad flat package - Wikipedia

    en.wikipedia.org/wiki/Quad_Flat_Package

    304-pin plastic quad flat package (QFP) ... TQFPs help solve issues such as increasing board density, die shrink programs, thin end-product profile and portability ...

  3. Flat no-leads package - Wikipedia

    en.wikipedia.org/wiki/Flat_no-leads_package

    Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to printed circuit boards. Flat no-leads, also known as micro leadframe (MLF) and SON (small-outline no leads), is a surface-mount technology , one of several package technologies that connect ICs to the ...

  4. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Quad flat package : various sizes, with pins on all four sides Low-profile quad flat-package ( LQFP ): 1.4 mm high, varying sized and pins on all four sides Plastic quad flat-pack ( PQFP ), a square with pins on all four sides, 44 or more pins

  5. Integrated circuit packaging - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_packaging

    In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline packages (TSOP) replaced PGA packages as the most common for high pin count devices, [1] though PGA packages are still often used for microprocessors. However, industry leaders Intel and AMD transitioned in the 2000s from PGA packages to land grid array (LGA) packages. [8]

  6. From plastic cutting boards to nonstick pans, these 5 kitchen ...

    www.aol.com/lifestyle/nonstick-pans-plastic...

    Plastic cutting boards. Research published last year in the journal Environmental Science & Technology found that using a plastic cutting board can create up to 7,680 flecks of plastic, which can ...

  7. Chip carrier - Wikipedia

    en.wikipedia.org/wiki/Chip_carrier

    A leadless chip carrier (LCC) has no "leads", but instead has rounded pins through the edges of the ceramic or molded plastic package. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic, while high-volume products for consumer and commercial markets are typically packaged in plastic.

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