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There are several methods for 3D IC design, including recrystallization and wafer bonding methods. There are two major types of wafer bonding, Cu-Cu connections (copper-to-copper connections between stacked ICs, used in TSVs) [18] [19] and through-silicon via (TSV). 3D ICs with TSVs may use solder microbumps, small solder balls as an interface between two individual dies in a 3D IC. [20]
Powerchip Semiconductor Manufacturing Corporation (PSMC) manufactures and sells semiconductor products, in particular memory chips and other integrated circuits.As of 2023, the company was the 8th largest semiconductor foundry in the world with four 12 inch and two 8 inch wafer labs. [1]
Block diagram of a NEC μPD7220 graphics display controller. A video display controller (VDC), also called a display engine or display interface, is an integrated circuit which is the main component in a video-signal generator, a device responsible for the production of a TV video signal in a computing or game system.
Lead times for chip orders at TSMC increased due to a tight capacity situation, putting fabless chip companies at risk of not meeting their sales expectations or shipment schedules, [96] and in August 2014 it was reported that TSMC's production capacity for the fourth quarter of 2014 was already almost fully booked, a scenario that had not ...
The term "Three-Dimensional Printing" was trademarked by the research group at MIT, along with the abbreviation 3DP. [ 5 ] [ 6 ] As a result, the term "3D printing" originally referred uniquely to the binder jet printing process prior to gaining wider acceptance as a term referring to all additive manufacturing processes.
Quanta Computer Building Gate in Hwa Ya Technology Park. Quanta Computer Incorporated (TWSE: 2382) (Chinese: 廣達電腦; pinyin: Guǎngdá Diànnǎo) is a Taiwan-based manufacturer of notebook computers and other electronic hardware.
The Intel X79 (codenamed Patsburg) is a Platform Controller Hub (PCH) designed and manufactured by Intel for their LGA 2011 (Socket R) and LGA 2011-1 (Socket R2).. Socket and chipset support CPUs targeted at the high-end desktop (HEDT) and enthusiast segments of the Intel product lineup: Core i7-branded and Xeon-branded processors from the Sandy Bridge and Ivy Bridge CPU architectures.
Computer-Aided Design (CAD) model used for 3D printing. The manual modeling process of preparing geometric data for 3D computer graphics is similar to plastic arts such as sculpting. 3D scanning is a process of collecting digital data on the shape and appearance of a real object, creating a digital model based on it.