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A plastic dual-in-line package containing an analog integrated circuit.This can be installed in a socket or directly soldered to a printed circuit board. A low current thyristor and a high power device, with a threaded stud for attachment to a heat sink, and a flexible lead; such packages are used for devices rated for hundreds of amperes.
In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
The other type of packaging used in the 1970s, called the ICP (Integrated Circuit Package), was a ceramic package (sometimes round as the transistor package), with the leads on one side, co-axially with the package axis. Commercial circuit packaging quickly moved to the dual in-line package (DIP), first in ceramic and later in plastic. [5]
Top and bottom of a WL-CSP package sitting on the face of a U.S. penny.In the top-right, a SOT23 package is shown for comparison.. A chip scale package or chip-scale package (CSP) is a type of integrated circuit package.
Shrink plastic dual in-line package (SPDIP) – A denser version of the PDIP with a 0.07 in (1.778 mm) lead pitch. Skinny dual in-line package (SDIP or SPDIP [ 6 ] ) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil ) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0. ...
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