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In 2002 Kingston launched a patented memory tester and a new HyperX line of high-performance memory modules, and also patented EPOC chip-stacking technology. In August of that year, Kingston made a $50 million investment in Elpida and launched a green initiative for module manufacturing. In 2004, Kingston announced revenues of $1.8B for 2003.
As an example, take an i945 memory controller with four Kingston KHX6400D2/1G memory modules, where each module has a capacity of 1 GiB. [2] Kingston describes each module as composed of 16 "64M×8-bit" chips with each chip having an 8-bit-wide data bus. 16 × 8 equals 128, therefore, each module has two ranks of 64 bits each.
The first DDR4 memory module prototype was manufactured by Samsung and announced in January 2011. [a] Physical comparison of DDR, DDR2, DDR3, and DDR4 SDRAM Front and back of 8 GB [1] DDR4 memory modules. 2005: Standards body JEDEC began working on a successor to DDR3 around 2005, [14] about 2 years before the launch of DDR3 in 2007.
In May 1991, Intel introduced an upgrade for IBM PS/2 Model 50 and 60 systems which contain 80286 microprocessors, converting them to full blown 32-bit systems. The SnapIn 386 module is a daughtercard with 20-MHz 386SX and 16-Kbyte direct-mapped cache SRAM memory. It directly plugs into the existing 286 socket with no cables, jumpers or switches.
With data being transferred 64 bits at a time per memory module, DDR3 SDRAM gives a transfer rate of (memory clock rate) × 4 (for bus clock multiplier) × 2 (for data rate) × 64 (number of bits transferred) / 8 (number of bits in a byte). Thus with a memory clock frequency of 100 MHz, DDR3 SDRAM gives a maximum transfer rate of 6400 MB/s.
The memory modules are installed into matching banks, each of which belongs to a different channel. The motherboard's manual will provide an explanation of how to install memory for that particular unit. A matched pair of memory modules may usually be placed in the first bank of each channel, and a different-capacity pair of modules in the ...