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Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
The dust buildup on this laptop CPU heatsink after three years of use has made the laptop unusable due to frequent thermal shutdowns. In operation, the temperature of a computer's components will rise until the heat transferred to the surroundings is equal to the heat produced by the component, that is, when thermal equilibrium is reached. For ...
When the CPU is idle, it will draw far less than the typical thermal power. Datasheets normally contain the thermal design power (TDP), which is the maximum amount of heat generated by the CPU, which the cooling system in a computer is required to dissipate.
A fan-cooled heat sink on the processor of a personal computer. To the right is a smaller heat sink cooling another integrated circuit of the motherboard. Typical heatsink-fan combination found on a consumer laptop.
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Advanced Configuration and Power Interface (ACPI) is an open standard that operating systems can use to discover and configure computer hardware components, to perform power management (e.g. putting unused hardware components to sleep), auto configuration (e.g. Plug and Play and hot swapping), and status monitoring.
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