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A twin boundary is a defect that introduces a plane of mirror symmetry in the ordering of a crystal. For example, in cubic close-packed crystals, the stacking sequence of a twin boundary would be ABCABCBACBA. On planes of single crystals, steps between atomically flat terraces can also be regarded as planar defects.
Although the criterion for deformation twin growth is not entirely understood, it is a tip-controlled phenomenon linked to the interaction between the residual and mobile twin partials at the twin interface; thermodynamically, this involves the elastic energy of the strained lattice, the interface and volume free-energy of the twin, and the ...
In mixed oxidation state materials like magnetite, antiphase domains and antiphase domain boundaries can occur as a result of charge-ordering even though there are no changes in atom locations. [4] For example, the reconstructed magnetite (100) surface contains alternating Fe II pairs and Fe III pairs in the first subsurface layer. [ 4 ]
Variations in the electrical conductivity and magnetic permeability of the test object, and the presence of defects causes a change in eddy current and a corresponding change in phase and amplitude that can be detected by measuring the impedance changes in the coil, which is a telltale sign of the presence of defects. [5]
Triangles and squares mark positions of the topological defects. A Wigner crystal is the solid (crystalline) phase of electrons first predicted by Eugene Wigner in 1934. [ 1 ] [ 2 ] A gas of electrons moving in a uniform, inert, neutralizing background (i.e. Jellium Model ) will crystallize and form a lattice if the electron density is less ...
Electrons cannot cross the insulating gap between the laminations and so are unable to circulate on wide arcs. Charges gather at the lamination boundaries, in a process analogous to the Hall effect, producing electric fields that oppose any further accumulation of charge and hence suppressing the eddy currents. The shorter the distance between ...
An Automated Optical Inspection device. Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew).
The most common method for delivering test data from chip inputs to internal circuits under test (CUTs, for short), and observing their outputs, is called scan-design. In scan design, registers ( flip-flops or latches) in the design are connected in one or more scan chains , which are used to gain access to internal nodes of the chip.