Search results
Results From The WOW.Com Content Network
The pad and wafer are pressed together by a dynamic polishing head and held in place by a plastic retaining ring. The dynamic polishing head is rotated with different axes of rotation (i.e., not concentric). This removes material and tends to even out any irregular topography, making the wafer flat or planar. This may be necessary to set up the ...
Wacker Chemie AG – divided into 5 divisions – derives most of its products from two main raw materials: silicon and ethylene. Siltronic supplies the semi-conductor market with wafers. Wacker Polysilicon produces hyper-pure electronic-grade polysilicon for use in electronic and solar wafers. Wacker Silicones serves end markets like ...
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...
SVM sells a variety of wafer diameters, including 100mm, 200mm, and 300mm Prime and Test device quality wafers. The company not only handles silicon, but also special materials such as gallium arsenide, indium phosphide, Silicon on Insulator and silicon carbide. SVM offers grinding, polishing, film deposition, and other related wafer processing ...
Silicon wafers are used to design channels, and PDMS is then poured over these wafers and left to harden. When removed, even the smallest of details is left imprinted in the PDMS. With this particular PDMS block, hydrophilic surface modification is conducted using plasma etching techniques. Plasma treatment disrupts surface silicon-oxygen bonds ...
The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [17] The adhesion promoter with a specific thickness is deposited, i.e. spin-coated or contact printed on the wafer to improve the bonding strength.
Here's how to put that little white sponge to use.
The etch chemistry is dispensed on the top side when in the machine and the bottom side is not affected. This etching method is particularly effective just before "backend" processing , where wafers are normally very much thinner after wafer backgrinding, and very sensitive to thermal or mechanical stress. Etching a thin layer of even a few ...