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Temperature increase becomes relevant for relatively small-cross-sections wires, where it may affect normal semiconductor behavior. Besides, since the generation of heat is proportional to the frequency of operation for switching circuits, fast computers have larger heat generation than slow ones, an undesired effect for chips manufacturers.
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
PSIM is an Electronic circuit simulation software package, designed specifically for use in power electronics and motor drive simulations but can be used to simulate any electronic circuit. Developed by Powersim, PSIM uses nodal analysis and the trapezoidal rule integration [2] as the basis of its simulation algorithm. PSIM provides a schematic ...
The EKV Mosfet model is a mathematical model of metal-oxide semiconductor field-effect transistors which is intended for circuit simulation and analog circuit design. [1] It was developed in the Swiss EPFL by Christian C. Enz, François Krummenacher and Eric A. Vittoz (hence the initials EKV) around 1995 based in part on work they had done in ...
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
The heat dissipation in integrated circuits problem has gained an increasing interest in recent years due to the miniaturization of semiconductor devices. The temperature increase becomes relevant for cases of relatively small-cross-sections wires, because such temperature increase may affect the normal behavior of semiconductor devices.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
It offers the ability to set up a circuit with a graphical user interface and simulate the large-signal, small-signal and noise behaviour of the circuit. Originally, Qucs was composed of a circuit simulator "qucs-core", now Qucsator, and a GUI for schematic entry and plotting. The usage patterns, as well as the emphasis on RF design, were ...