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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
The selection of a heat sink may end up with overheating (and CPU reduced performances) or overcooling (oversized, expensive heat sink), depending if one chooses a too high or a too low case temperature Tc (respectively with a too low or too high ambient temperature Ta), or if the CPU operates with different computational loads.
Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes.
Aluminum is the most prominently used heat sink material because of its lower cost. [46] Copper heat sinks are a necessity when higher levels of thermal conductivity are needed. An alternative to all-copper or all-aluminum heat sinks is the joining of aluminum fins to a copper base. [47] Copper heat sinks are die-cast and bound together in ...
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
Material selection is often benefited by the use of material index or performance index relevant to the desired material properties. [2] For example, a thermal blanket must have poor thermal conductivity in order to minimize heat transfer for a given temperature difference. It is essential that a designer should have a thorough knowledge of the ...
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat ...