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The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...
The heat flow can be modelled by analogy to an electrical circuit where heat flow is represented by current, temperatures are represented by voltages, heat sources are represented by constant current sources, absolute thermal resistances are represented by resistors and thermal capacitances by capacitors.
Fairchild Semiconductor's Quad-MOSFET Solution Boosts Efficiency and Eliminates Heat Sinking in Active Bridge Applications Four 60V MOSFETs in a Single Package Increases System Efficiency, ...
For a device with a TDP of 100 W, for thermal runaway to occur, the heat sink would have to have a thermal resistivity of over 3 K/W (kelvins per watt), which is about 6 times worse than a stock Athlon 64 heat sink. (A stock Athlon 64 heat sink is rated at 0.34 K/W, although the actual thermal resistance to the environment is somewhat higher ...
If the MOSFET is an n-channel or nMOS FET, then the source and drain are n+ regions and the body is a p region. If the MOSFET is a p-channel or pMOS FET, then the source and drain are p+ regions and the body is a n region. The source is so named because it is the source of the charge carriers (electrons for n-channel, holes for p-channel) that ...
Pd = Thermal power generated by a CPU and to be dissipated into the ambient through a suitable Heat sink. It corresponds to the total power drain from the direct current supply rails of the CPU. Rca (°C/W) = Thermal resistance of the Heat sink, between the case of the CPU and the ambient air.
Junction temperature, short for transistor junction temperature, [1] is the highest operating temperature of the actual semiconductor in an electronic device. In operation, it is higher than case temperature and the temperature of the part's exterior.