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  2. Gold plating - Wikipedia

    en.wikipedia.org/wiki/Gold_plating

    The thickness of gold plating on jewellery is noted in microns (or micro-meters). The microns of thickness determines how long the gold plating lasts with usage. The jewellery industry denotes different qualities of gold plating in the following terminology Gold flashed / Gold washed - gold layer thickness less than 0.5 micron

  3. Jewelry District (Los Angeles) - Wikipedia

    en.wikipedia.org/wiki/Jewelry_District_(Los_Angeles)

    The Jewelry District is predominantly made up of early twentieth-century buildings. Half of the area falls under the greater "Historic Core" of downtown Los Angeles, which spans between Hill and Main Streets, and 3rd and 9th streets. The median year in which the buildings in the area were built was 1923.

  4. Plating - Wikipedia

    en.wikipedia.org/wiki/Plating

    Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for ...

  5. Gold has never been this expensive

    www.aol.com/finance/gold-never-expensive...

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  6. Gold-filled jewelry - Wikipedia

    en.wikipedia.org/wiki/Gold-filled_jewelry

    Gold-filled is a type of composite material. Composites are formed from two or more constituent materials with different properties that, when combined, create a new material with enhanced properties. [1] Gold-filled material is made by bonding a layer of gold alloy to a base metal core (typically brass, but sometimes copper or silver).

  7. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.