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  2. Physical design (electronics) - Wikipedia

    en.wikipedia.org/wiki/Physical_design_(electronics)

    In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design.At this step, circuit representations of the components (devices and interconnects) of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components.

  3. Interconnect (integrated circuits) - Wikipedia

    en.wikipedia.org/wiki/Interconnect_(integrated...

    IC with complex circuits require multiple levels of interconnect to form circuits that have minimal area. As of 2018, the most complex ICs may have over 15 layers of interconnect. Each level of interconnect is separated from each other by a layer of dielectric. To make vertical connections between interconnects on different levels, vias are

  4. Design rule checking - Wikipedia

    en.wikipedia.org/wiki/Design_rule_checking

    A two layer rule specifies a relationship that must exist between two layers. For example, an enclosure rule might specify that an object of one type, such as a contact or via, must be covered, with some additional margin, by a metal layer. A typical value as of 2007 might be about 10 nm. There are many other rule types not illustrated here.

  5. Interaural time difference - Wikipedia

    en.wikipedia.org/wiki/Interaural_time_difference

    The model used had a distance between the two ears of approximately 22–23 cm. Initial measurements found that there was a maximum time delay of approximately 660 μs when the sound source was placed at directly 90° azimuth to one ear. This time delay correlates to the wavelength of a sound input with a frequency of 1500 Hz.

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  7. Shallow trench isolation - Wikipedia

    en.wikipedia.org/wiki/Shallow_trench_isolation

    Shallow trench isolation (STI), also known as box isolation technique, is an integrated circuit feature which prevents electric current leakage between adjacent semiconductor device components. STI is generally used on CMOS process technology nodes of 250 nanometers and smaller.

  8. Wire chamber - Wikipedia

    en.wikipedia.org/wiki/Wire_chamber

    The chamber was an advancement of the earlier bubble chamber rate of detection of only one or two particles every second to 1000 particle detections every second. The MWPC produced electronic signals from particle detection, allowing scientists to examine data via computers. [5] [6] [7] The multi-wire chamber is a development of the spark ...

  9. Time projection chamber - Wikipedia

    en.wikipedia.org/wiki/Time_projection_chamber

    The Dark Matter Time Projection Chamber is an experiment for direct detection of weakly interacting massive particles (WIMPs), one of the most favored candidates for dark matter. The experiment uses a low-pressure time projection chamber in order to extract the original direction of potential dark matter events.