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TO-252, also known as DPAK [1] or Decawatt Package, is a semiconductor package developed by Motorola [2] for surface mounting on circuit boards. [3] It represents a surface-mount [4] variant of TO-251 package, and smaller variant of the D2PAK package. It is often used for high-power MOSFETs and voltage regulators.
TO-252: [24] (also called SOT428, DPAK): [24] SMT package similar to the DPAK but smaller TO-262 : [ 24 ] Also called I2PAK: SMT package similar to the D2PAK but with longer leads for SMT or TH mounting
[1] [2] They are similar to the earlier TO-220-style packages intended for high power dissipation [2] [4] but lack the extended metal tab and mounting hole, while representing a larger version of the TO-252, also known as DPAK, SMT package.
78M05 in a TO-252 (DPAK) surface-mount package. STMicroelectronics 78L05A in a SO-8 surface-mount package with larger solder pads on the left for wave soldering.
TO-252, also known as DPAK, a semiconductor package; David Pakman, an Argentine-American leftist political commentator This page was last edited on 21 ...
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer.
Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made of silicon chips and a casting compound.
Intel 80186 in QFJ68 / PLCC68, an example of a plastic leaded chip carrier. In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips").