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Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]
Resoldering with lead-tin solder forms indium-tin and indium-lead phases and ... of soldering iron tips and part leads in molten solder. Sn 63 Pb 37 P 0.0015-0. ...
Common solder formulations based on tin and lead are listed below. The fraction represent percentage of tin first, then lead, totaling 100%: 63/37: melts at 183 °C (361 °F) (eutectic: the only mixture that melts at a point, instead of over a range) 60/40: melts between 183–190 °C (361–374 °F)
Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [10] ... Sn 63.0, Pb 37.0: 183 °C (361 °F) no: Eutectic solder.
Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.
The solder grade used for leadworking is plumber's solder (80% lead / 20% tin). [i] Although this is thought of as a high melting point solder amongst lead-tin solders, the solidus is relatively constant for all of these solders and it is the liquidus which climbs from the eutectic point at Sn 63% / Pb 37%.