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  2. Chipseal - Wikipedia

    en.wikipedia.org/wiki/Chipseal

    Chip seal products can be installed over gravel roads to eliminate the cost of grading, road roughness, dust, mud, and the cost of adding gravel lost from grading. Adding chip seal over gravel is about 25% of the price of resurfacing with asphalt, $170,000 for a 4-mile project done in Minnesota [6] compared to $760,000 had it been redone with ...

  3. class 10, class 100, etc. – a measure of the air quality in a cleanroom; class 10 means fewer than 10 airborne particles of size 0.5 μm or larger are permitted per cubic foot of air; cleanroom (clean room) – a specialized manufacturing environment that maintains extremely low levels of particulates; CMP – see chemical-mechanical polishing

  4. List of semiconductor fabrication plants - Wikipedia

    en.wikipedia.org/wiki/List_of_semiconductor...

    1.6, 1.7, 1.8 (estimates) (combined costs of installation of equipment at Phase 1 and construction of Phase 2) [118] [104] 2018 300 BiCS FLASH™ Kioxia [115] [116] Y6 (phase 2) (at Yokkaichi Operations) Japan, Yokkaichi 1.6, 1.7, 1.8 (estimates) (combined costs of installation of equipment at Phase 1 and construction of Phase 2) [118] [104 ...

  5. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    Chip-on-glass (COG), a variation of COB, where a chip, typically a liquid crystal display (LCD) controller, is mounted directly on glass. Chip-on-wire (COW), a variation of COB, where a chip, typically a LED or RFID chip, is mounted directly on wire, thus making it a very thin and flexible wire.

  6. Semiconductor fabrication plant - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_fabrication...

    In the microelectronics industry, a semiconductor fabrication plant, also called a fab or a foundry, is a factory where integrated circuits (ICs) are manufactured. [1]The cleanroom is where all fabrication takes place and contains the machinery for integrated circuit production such as steppers and/or scanners for photolithography, etching, cleaning, and doping.

  7. Electronic packaging - Wikipedia

    en.wikipedia.org/wiki/Electronic_packaging

    Electronic packaging can be organized by levels: Level 0 - "Chip", protecting a bare semiconductor die from contamination and damage. Level 1 - Component, such as semiconductor package design and the packaging of other discrete components.

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