Search results
Results From The WOW.Com Content Network
A twin boundary is a defect that introduces a plane of mirror symmetry in the ordering of a crystal. For example, in cubic close-packed crystals, the stacking sequence of a twin boundary would be ABCABCBACBA. On planes of single crystals, steps between atomically flat terraces can also be regarded as planar defects.
The twin thickness saturated once a critical residual dislocations’ density reached the coherent twin-parent crystal boundary. [ 33 ] [ 49 ] Significant attention has been paid to the crystallography , [ 50 ] morphology [ 51 ] and macro mechanical effects [ 52 ] of deformation twinning.
In a TEM, bright field imaging is one technique used to identify the location of stacking faults. Typical image of stacking fault is dark with bright fringes near a low-angle grain boundary, sandwiched by dislocations at the end of the stacking fault. Fringes indicate that the stacking fault is at an incline with respect to the viewing plane. [3]
The defect or discontinuity creates a characteristic parabolic indication, due to the apparent change in depth as the probes travel. Manually-guided TOFD probes. Time-of-flight diffraction (TOFD) method of ultrasonic testing is a sensitive and accurate method for the nondestructive testing of welds for defects.
Variations in the electrical conductivity and magnetic permeability of the test object, and the presence of defects causes a change in eddy current and a corresponding change in phase and amplitude that can be detected by measuring the impedance changes in the coil, which is a telltale sign of the presence of defects. [5]
In crystallography, a vacancy is a type of point defect in a crystal where an atom is missing from one of the lattice sites. [2] Crystals inherently possess imperfections, sometimes referred to as crystallographic defects. Vacancies occur naturally in all crystalline materials.
An electron backscatter diffraction pattern of monocrystalline silicon, taken at 20 kV with a field-emission electron source. Electron backscatter diffraction (EBSD) is a scanning electron microscopy (SEM) technique used to study the crystallographic structure of materials.
There are mainly two types of grain boundary sliding: Rachinger sliding, [2] and Lifshitz sliding. [3] Grain boundary sliding usually occurs as a combination of both types of sliding. Boundary shape often determines the rate and extent of grain boundary sliding. [4] Grain boundary sliding is a motion to prevent intergranular cracks from forming.