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The twin thickness saturated once a critical residual dislocations’ density reached the coherent twin-parent crystal boundary. [ 33 ] [ 49 ] Significant attention has been paid to the crystallography , [ 50 ] morphology [ 51 ] and macro mechanical effects [ 52 ] of deformation twinning.
A twin boundary is a defect that introduces a plane of mirror symmetry in the ordering of a crystal. For example, in cubic close-packed crystals, the stacking sequence of a twin boundary would be ABCABCBACBA. On planes of single crystals, steps between atomically flat terraces can also be regarded as planar defects.
Grain boundaries are two-dimensional defects in the crystal structure, and tend to decrease the electrical and thermal conductivity of the material. Most grain boundaries are preferred sites for the onset of corrosion [1] and for the precipitation of new phases from the solid. They are also important to many of the mechanisms of creep. [2]
The cracks are intergranular and occur at grain boundaries. There is no evidence of stress corrosion or fatigue. [1] [5] The presence of a relatively high lead content has been identified as a contributory factor. Cracking at the grain boundaries is accelerated in the presence of lead. The presence of bismuth is also suspected to be ...
In mixed oxidation state materials like magnetite, antiphase domains and antiphase domain boundaries can occur as a result of charge-ordering even though there are no changes in atom locations. [4] For example, the reconstructed magnetite (100) surface contains alternating Fe II pairs and Fe III pairs in the first subsurface layer. [ 4 ]
In a TEM, bright field imaging is one technique used to identify the location of stacking faults. Typical image of stacking fault is dark with bright fringes near a low-angle grain boundary, sandwiched by dislocations at the end of the stacking fault. Fringes indicate that the stacking fault is at an incline with respect to the viewing plane. [3]
If the images are interpreted correctly, they can be used to identify crystal structures, determine their orientations, measure crystal characteristics, examine crystal defects or material textures. The course of analysis depends on whether the diffractogram depicts ring or spot diffraction pattern and on the quantity to be determined.
Umklapp scattering is one process limiting the thermal conductivity in crystalline materials, the others being phonon scattering on crystal defects and at the surface of the sample. The left panel of Figure 1 schematically shows the possible scattering processes of two incoming phonons with wave-vectors ( k -vectors) k 1 and k 2 (red) creating ...