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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
A suitably chosen material coating can reduce the effects of mechanical stress and vibrations on the circuit and its ability to perform in extreme temperatures. For example, in a chip-on-board assembly process, a silicon die is mounted on the board with an adhesive or soldering process, and then it is electrically connected by wire bonding ...
IPC TM-650 2.6.25 provides a test method to assess CAF susceptibility. [1] Additionally, IPC TM-650 2.6.16 provides a pressure vessel test method to rapidly evaluate glass epoxy laminate integrity. [6] This is helpful but it may often be better to use design rules and proper material selection to proactively mitigate the issue.
Solder paste is thixotropic, meaning that its viscosity changes with applied shear force (such as stirring or spreading). The thixotropic index is a measure of the viscosity of the solder paste at rest, compared to the viscosity of "worked" paste. Depending upon the formulation of the paste, it may be very important to stir the paste before use ...
A printed circuit board (PCB), also called printed wiring board (PWB), is a laminated sandwich structure of conductive and insulating layers, each with a pattern of traces, planes and other features (similar to wires on a flat surface) etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive ...
The screws, washers, and case may each be made of homogenous materials, but the other components comprise multiple sub-components of many different types of material. For instance, a circuit board is composed of a bare printed circuit board (PCB), integrated circuits (IC), resistors, capacitors, switches, etc.
The integrated circuit package must resist physical breakage, keep out moisture, and also provide effective heat dissipation from the chip. Moreover, for RF applications, the package is commonly required to shield electromagnetic interference, that may either degrade the circuit performance or adversely affect neighboring circuits.
IPC standards revised the definition of a microvia in 2013 to a hole with depth to diameter aspect ratio of 1:1 or less, and the hole depth not to exceed 0.25mm. Previously, microvia was any hole less than or equal to 0.15mm in diameter [ 2 ]