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Luigi Valentino Brugnatelli (also Luigi Gaspare Brugnatelli or Luigi Vincenzo Brugnatelli) (14 February 1761 in Pavia – 24 October 1818 in Pavia) was an Italian chemist and inventor who discovered the process for electroplating in 1805.
Electroplating was invented by Italian chemist Luigi Valentino Brugnatelli in 1805. Brugnatelli used his colleague Alessandro Volta's invention of five years earlier, the voltaic pile, to facilitate the first electrodeposition.
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In 1928, Luigi Brugnatelli, professor of Mineralogy at the University of Pavia and grandson of Luigi Valentino Brugnatelli, donated the building to the University of Pavia, [5] which after careful restoration, reopened it in 1948 and transformed it into the College Castiglioni Brugnatelli.
Luigi Valentino Brugnatelli; Metadata. This file contains additional information, probably added from the digital camera or scanner used to create or digitize it.
Barrel plating for electrical components (e.g. ceramic capacitors) used to grow terminals. Barrel plating is a form of electroplating used for plating a large number of smaller metal objects in one sitting. It consists of a non-conductive barrel-shaped cage in which the objects are placed before being subjected to the chemical bath in which ...
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.