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The first DDR4 memory module prototype was manufactured by Samsung and announced in January 2011. [a] Physical comparison of DDR, DDR2, DDR3, and DDR4 SDRAM Front and back of 8 GB [1] DDR4 memory modules. 2005: Standards body JEDEC began working on a successor to DDR3 around 2005, [14] about 2 years before the launch of DDR3 in 2007.
Corsair expanded its DRAM memory module production into the high end market for overclocking. [8] This expansion allows for high power platforms and the ability to get more performance out of the CPU and RAM. The Corsair Vengeance Pro series and Corsair Dominator Platinum series are built for overclocking applications. [9] [10] [11]
Product binning is the categorizing of finished products based on their characteristics. [1] Any mining, harvesting, or manufacturing process will yield products spanning a range of quality and desirability in the marketplace.
A memory rank is a set of DRAM chips connected to the same chip select, which are therefore accessed simultaneously. In practice all DRAM chips share all of the other command and control signals, and only the chip select pins for each rank are separate (the data pins are shared across ranks).
At Hot Chips 2016, Samsung announced GDDR6 as the successor of GDDR5X. [5] [6] Samsung later announced that the first products would be 16 Gbit/s, 1.35 V chips.[7] [8] In January 2018, Samsung began mass production of 16 Gb (2 GB) GDDR6 chips, fabricated on a 10 nm class process and with a data rate of up to 18 Gbit/s per pin.
In computing, serial presence detect (SPD) is a standardized way to automatically access information about a memory module.Earlier 72-pin SIMMs included five pins that provided five bits of parallel presence detect (PPD) data, but the 168-pin DIMM standard changed to a serial presence detect to encode more information.