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At Hot Chips 2016, Samsung announced GDDR6 as the successor of GDDR5X. [5] [6] Samsung later announced that the first products would be 16 Gbit/s, 1.35 V chips.[7] [8] In January 2018, Samsung began mass production of 16 Gb (2 GB) GDDR6 chips, fabricated on a 10 nm class process and with a data rate of up to 18 Gbit/s per pin.
DDR4 RAM operates at a voltage of 1.2 V and supports frequencies between 800 and 1600 MHz (DDR4-1600 through DDR4-3200). Compared to DDR3, which operates at 1.5 V with frequencies from 400 to 1067 MHz (DDR3-800 through DDR3-2133), DDR4 offers better performance and energy efficiency .
In the late 1980s IBM invented DDR SDRAM, they built a dual-edge clocking RAM and presented their results at the International Solid-State Circuits Convention in 1990. [ 6 ] [ 7 ] Samsung released the first commercial DDR SDRAM chip (64 Mbit ) in June 1998, [ 3 ] followed soon after by Hyundai Electronics (now SK Hynix ) the same year. [ 8 ]
A third bank group bit (BG2) was added, allowing up to eight bank groups (2 → 3). The maximum number of banks per bank group remains at four (2 → 2), The number of row address bits remains at 17, for a maximum of 128K rows (17 → 17). One more column address bit (C10) is added, allowing up to 8192 columns (1 KB pages) in ×4 chips (11 → 12).
Double Data Rate 2 Synchronous Dynamic Random-Access Memory (DDR2 SDRAM) is a double data rate (DDR) synchronous dynamic random-access memory (SDRAM) interface. It is a JEDEC standard (JESD79-2); first published in September 2003. [2] DDR2 succeeded the original DDR SDRAM specification, and was itself succeeded by DDR3 SDRAM in 2007.
A 64 bit memory chip die, the SP95 Phase 2 buffer memory produced at IBM mid-1960s, versus memory core iron rings 8GB DDR3 RAM stick with a white heatsink. Random-access memory (RAM; / r æ m /) is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code.