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  2. Failure of electronic components - Wikipedia

    en.wikipedia.org/wiki/Failure_of_electronic...

    Electrostatic discharge (ESD) is a subclass of electrical overstress and may cause immediate device failure, permanent parameter shifts and latent damage causing increased degradation rate. It has at least one of three components, localized heat generation, high current density and high electric field gradient; prolonged presence of currents of ...

  3. Bent pin analysis - Wikipedia

    en.wikipedia.org/wiki/Bent_Pin_Analysis

    For example, a failure mode might be listed on the FMEA worksheet as “Pin A shorts Pin K,” and the corresponding local level failure effect might be “Input Signal X shorts Signal Y normal path.” (Here, bent Pin A carries Signal X and undamaged Pin K carries Signal Y.) Note that the failure mode “Pin A shorts Pin K” is very different ...

  4. Coupon (PWB) - Wikipedia

    en.wikipedia.org/wiki/Coupon_(PWB)

    A coupon or test coupon is a printed circuit board (PCB) used to test the quality of a printed wiring board (PWB) fabrication process. Test coupons are fabricated on the same panel as the PWBs, typically at the edges. Coupons are then inspected to ensure proper layer alignment, electrical connectivity, and cross sectioned to inspect internal ...

  5. Conductive anodic filament - Wikipedia

    en.wikipedia.org/wiki/Conductive_anodic_filament

    CAF formation is a process involving the transport of conductive chemistries across a nonmetallic substrate under the influence of an applied electric field. [1] CAF is influenced by electric field strength, temperature (including soldering temperatures), humidity, laminate material, and the presence of manufacturing defects. The occurrence of ...

  6. Worst-case circuit analysis - Wikipedia

    en.wikipedia.org/wiki/Worst-case_circuit_analysis

    In addition to a circuit analysis, a WCCA often includes stress and derating analysis, failure modes and effects criticality and reliability prediction . The specific objective is to verify that the design is robust enough to provide operation which meets the system performance specification over design life under worst-case conditions and ...

  7. Power-off testing - Wikipedia

    en.wikipedia.org/wiki/Power-off_testing

    Power-off testing is often necessary to test the printed circuit assembly (PCA) board due to uncertainty as to the nature of the failure. When the PCA can be further damaged by applying power it is necessary to use power off test techniques to safely examine it.

  8. Electrical fault - Wikipedia

    en.wikipedia.org/wiki/Electrical_fault

    In an electric power system, a fault or fault current is any abnormal electric current. For example, a short circuit is a fault in which a live wire touches a neutral or ground wire. An open-circuit fault occurs if a circuit is interrupted by a failure of a current-carrying wire (phase or neutral) or a blown fuse or circuit breaker.

  9. Physics of failure - Wikipedia

    en.wikipedia.org/wiki/Physics_of_failure

    where Z is maximum displacement, PSD is the power spectral density (g 2 /Hz), f n is the natural frequency of the CCA, Q is transmissibility (assumed to be square root of natural frequency), Z c is the critical displacement (20 million cycles to failure), B is the length of PCB edge parallel to component located at the center of the board, c is ...