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Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Thermal paste: Mostly used in the electronics industry, thermal pastes provide a very thin bond line and therefore a very small thermal resistance. They have no mechanical strength (other than the surface tension of the paste and the resulting adhesive effect) and require an external mechanical fixation mechanism.
Arctic Silver Inc. is a privately owned engineering corporation which develops and manufactures thermally conductive compounds and thermal adhesives for the application of heat sinks to high-powered electronic components such as processors, LEDs, chipsets and other electronic devices.
Hot-melt adhesives have a long shelf life and usually can be disposed of without special precautions. Some of the disadvantages involve thermal load of the substrate, limiting use to substrates not sensitive to higher temperatures, and loss of bond strength at higher temperatures, up to complete melting of the adhesive.
Thermal adhesive; Thermal paste; Thread-locking fluid; Titanium adhesive bonding; U. UHU; Use of adhesives in structural steel applications; W. Wallpaper paste; Water ...