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A desoldering pump, colloquially known as a solder sucker, is a manually-operated device which is used to remove solder from a printed circuit board. There are two types: the plunger style and bulb style. [1] (. An electrically-operated pump for this purpose would usually be called a vacuum pump.)
Soldering. Desoldering a contact from a wire. Soldering (US: / ˈsɒdərɪŋ /; UK: / ˈsoʊldərɪŋ /) is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong ...
For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...
In electronics, rework (or re-work) is the repair or refinish of a printed circuit board (PCB) assembly, usually involving desoldering and re- soldering of surface-mounted electronic components (SMD). Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using ...
A gas-fired soldering iron. A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces. A soldering iron is composed of a heated metal tip (the bit) and an insulated handle. Heating is often achieved electrically, by passing an electric current (supplied through ...
A fusible alloy is a metal alloy capable of being easily fused, i.e. easily meltable, at relatively low temperatures. Fusible alloys are commonly, but not necessarily, eutectic alloys. Sometimes the term "fusible alloy" is used to describe alloys with a melting point below 183 °C (361 °F; 456 K). Fusible alloys in this sense are used for solder.
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. [1] This technique utilizes low melting-point glass ("glass solder") and ...