Search results
Results From The WOW.Com Content Network
Lead frame of a surface-mount technology package. Most kinds of integrated circuit packaging are made by placing a silicon chip on a lead frame, wire bonding the chip to the metal leads of the lead frame, and covering the chip with plastic. The metal leads protruding from the plastic are then either "cut long" and bent to form through-hole pins ...
The heatspreader versions give the system designer greater latitude in thermally-enhanced board level and/or system design. RoHS compliant, lead-free and green material sets are now qualified standards. Leaded chip carrier extraction tool. Vacuum picks may also be used instead. A PLCC circuit may either be installed in a PLCC socket or surface ...
In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
Flat no-lead is a near chip scale plastic encapsulated package made with a planar copper lead frame substrate. Perimeter lands on the package bottom provide electrical connections to the PCB. [1] Flat no-lead packages usually, but not always, include an exposed thermally conductive pad to improve heat transfer out of the IC (into the PCB).
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package ", supports the electrical contacts which connect the device to a circuit board.
Shrink plastic dual in-line package (SPDIP) – A denser version of the PDIP with a 0.07 in (1.778 mm) lead pitch. Skinny dual in-line package (SDIP or SPDIP [ 6 ] ) – Sometimes used to refer to a "narrow" 0.300 in. (or 300 mil ) wide DIP, normally when clarification is needed e.g. for DIP with 24 pins or more, which usually come in "wide" 0. ...
Shrink small-outline package (SSOP) chips have "gull wing" leads protruding from the two long sides, and a lead spacing of 0.65 mm (0.0256 inches) or 0.635 mm (0.025 inches ). [4] 0.5 mm lead spacing is less common, but not rare. The body size of a SOP was compressed and the lead pitch tightened to obtain a smaller version SOP.
Lead counts range from 32 to 176. Body sizes range from 5 mm × 5 mm to 20 × 20 mm. Copper lead-frames are used in TQFPs. Lead pitches available for TQFPs are 0.4 mm, 0.5 mm, 0.65 mm, 0.8 mm, and 1.0 mm. PQFP, or plastic quad flat pack, is a type of QFP, as is the thinner TQFP package. PQFP packages can vary in thickness from 2.0 mm to 3.8 mm.