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  2. Integrated circuit layout - Wikipedia

    en.wikipedia.org/wiki/Integrated_circuit_layout

    Layout view of a simple CMOS operational amplifier. In integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit.

  3. Circuit diagram - Wikipedia

    en.wikipedia.org/wiki/Circuit_diagram

    A circuit diagram (or: wiring diagram, electrical diagram, elementary diagram, electronic schematic) is a graphical representation of an electrical circuit. A pictorial circuit diagram uses simple images of components, while a schematic diagram shows the components and interconnections of the circuit using standardized symbolic representations ...

  4. List of LM-series integrated circuits - Wikipedia

    en.wikipedia.org/wiki/List_of_LM-series...

    Because of the popularity of these parts, many of them were second-sourced by other manufacturers who kept the sequence number as an aid to identification of compatible parts. [3] Several generations of pin-compatible descendants of the original parts have since become de facto standard electronic components.

  5. Reference designator - Wikipedia

    en.wikipedia.org/wiki/Reference_designator

    The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15. The number is sometimes followed by a letter, indicating that components are grouped or matched with each other, e.g. R17A, R17B. The IEEE 315 standard contains a list of Class Designation Letters to use for electrical and electronic ...

  6. Die (integrated circuit) - Wikipedia

    en.wikipedia.org/wiki/Die_(integrated_circuit)

    A die can host many types of circuits. One common use case of an integrated circuit die is in the form of a central processing unit (CPU). Through advances in modern technology, the size of the transistor within the die has shrunk exponentially, following Moore's law.

  7. Three-dimensional integrated circuit - Wikipedia

    en.wikipedia.org/wiki/Three-dimensional...

    Electronic components are built on two semiconductor wafers. One wafer is diced; the singulated dice are aligned and bonded onto die sites of the second wafer. As in the wafer-on-wafer method, thinning and TSV creation are performed either before or after bonding. Additional die may be added to the stacks before dicing. [22] Wafer-to-Wafer

  8. Placement (electronic design automation) - Wikipedia

    en.wikipedia.org/wiki/Placement_(electronic...

    Placement is an essential step in electronic design automation — the portion of the physical design flow that assigns exact locations for various circuit components within the chip's core area. An inferior placement assignment will not only affect the chip 's performance but might also make it non-manufacturable by producing excessive wire ...

  9. Integrated injection logic - Wikipedia

    en.wikipedia.org/wiki/Integrated_injection_logic

    Simplified schematic of an I2L inverter. Integrated injection logic (IIL, I 2 L, or I2L) is a class of digital circuits built with multiple collector bipolar junction transistors (BJT). [1]