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LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5 ) and it has 1700 protruding pins to make contact with the pads on the processor.
LGA 1156 LGA 1155 LGA 1150 LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm, 45 nm, 65 nm 2.9 W – 73 W 1 or 2, 2 /w hyperthreading 800 MHz, 1066 MHz, 2.5GT/s, 5 GT/s 64 KiB per core 2x256 KiB – 2 MiB 0 KiB – 3 MiB Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2
A water block is the watercooling equivalent of a heatsink. It is a type of plate heat exchanger and can be used on many different computer components, [1]: 186 including the central processing unit (CPU), GPU, PPU, and northbridge chipset on the motherboard. There are also Monoblocks on the market that are mounted on PC motherboards and cover ...
LGA 1700 (Socket V0) LGA 1851 (Socket V1) LGA 2011 (Socket R) LGA 2011-3 (Socket R3) – note that LGA 2011-3 is incompatible with LGA 2011 and is used for Haswell-E and Broadwell-E Intel Core i7 extreme processors and the Intel X99 chipset. It does, however have the same pin count and design as LGA 2011. Also used for Xeon E5 processors and ...
CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as increased mechanical stability.
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.