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Portable cold saw with the chip catcher detached. A cold saw is a circular saw designed to cut metal which uses a toothed blade to transfer the heat generated by cutting to the chips created by the saw blade, allowing both the blade and material being cut to remain cool. [1]
Chip formation is part of the process of cutting materials by mechanical means, using tools such as saws, lathes and milling cutters.. The formal study of chip formation was encouraged around World War II and shortly afterwards, with increases in the use of faster and more powerful cutting machines, particularly for metal cutting with the new high speed steel cutters.
Chain catcher. The chain catcher helps prevent the chain being thrown back towards the user, if the chain breaks or becomes derailed. [1] [3] The catcher catches the chain when it derails downwards and shortens it. Then the chain moves underneath the saw body smashing against the rear hand protection at the rear handle (The bottom of the handle ...
The ideal chip shape is small and breaks free early, carrying heat away from the tool and work. Threads per inch (TPI) for taps, die heads and threading tools. Cut Width. Any time the width of cut is less than half the diameter, a geometric phenomenon called Chip Thinning reduces the actual chipload.
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A hand-held circular saw is the most conventional circular saw. This miter saw is a circular saw mounted to swing to crosscut wood at an angle. A table saw. Tractor-driven circular saw. A circular saw or a buzz saw, is a power-saw using a toothed or abrasive disc or blade to cut different materials using a rotary motion spinning around an arbor.
Various examples of swarf, including a block of compressed swarf. Swarf, also known as chips or by other process-specific names (such as turnings, filings, or shavings), are pieces of metal, wood, or plastic that are the debris or waste resulting from machining, woodworking, or similar subtractive (material-removing) manufacturing processes.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.