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The relationship between thermal conductivity and conductance is analogous to the relationship between electrical conductivity and electrical conductance. Thermal resistance is the inverse of thermal conductance. [6] It is a convenient measure to use in multicomponent design since thermal resistances are additive when occurring in series. [7]
In general, works using the term "thermal resistance" are more engineering-oriented, whereas works using the term thermal conductivity are more [pure-]physics-oriented. The following books are representative, but may be easily substituted. Terry M. Tritt, ed. (2004). Thermal Conductivity: Theory, Properties, and Applications. Springer Science ...
Interfacial thermal resistance is a measure of an interface's resistance to thermal flow. This thermal resistance differs from contact resistance, as it exists even at atomically perfect interfaces. Understanding the thermal resistance at the interface between two materials is of primary significance in the study of its thermal properties.
For a property R that changes when the temperature changes by dT, the temperature coefficient α is defined by the following equation: d R R = α d T {\displaystyle {\frac {dR}{R}}=\alpha \,dT} Here α has the dimension of an inverse temperature and can be expressed e.g. in 1/K or K −1 .
Defining equation SI unit Dimension Temperature gradient: No standard symbol K⋅m −1: ΘL −1: Thermal conduction rate, thermal current, thermal/heat flux, thermal power transfer P = / W ML 2 T −3: Thermal intensity I = / W⋅m −2
Plot of the Wiedemann–Franz law for copper. Left axis: specific electric resistance ρ in 10 −10 Ω m, red line and specific thermal conductivity λ in W/(K m), green line. Right axis: ρ times λ in 100 U 2 /K, blue line and Lorenz number ρ λ / K in U 2 /K 2, pink line. Lorenz number is more or less constant.
A direct practical application of the heat equation, in conjunction with Fourier theory, in spherical coordinates, is the prediction of thermal transfer profiles and the measurement of the thermal diffusivity in polymers (Unsworth and Duarte). This dual theoretical-experimental method is applicable to rubber, various other polymeric materials ...
In physics, thermal contact conductance is the study of heat conduction between solid or liquid bodies in thermal contact. The thermal contact conductance coefficient , h c {\displaystyle h_{c}} , is a property indicating the thermal conductivity , or ability to conduct heat , between two bodies in contact.