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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).
The IPC preferred term for an assembled board is circuit card assembly (CCA), [19] and for an assembled backplane it is backplane assembly. "Card" is another widely used informal term for a "printed circuit assembly". For example, expansion card. A PCB may be printed with a legend identifying the components, test points, or identifying
Bare die supplied without a package. It is mounted directly to the PCB using bonding wires and covered with a blob of black Epoxy. [22] Also used for LEDs. In LEDs, transparent epoxy or a silicon caulk-like material that may contain a phosphor is poured into a mold containing the LED(s) and cured. The mold forms part of the package. COF: Chip ...
Finally, the package must permit interconnecting the chip to a PCB. [1] The materials of the package are either plastic (thermoset or thermoplastic), metal (commonly Kovar) or ceramic. A common plastic used for this is epoxy-cresol-novolak (ECN). [2] All three material types offer usable mechanical strength, moisture and heat resistance.
PCB via current capacity chart showing 1 mil plating via current capacity & resistance versus diameter on a 1.6 mm PCB. In printed circuit board (PCB) design, a via consists of two pads in corresponding positions on different copper layers of the board, that are electrically connected by a hole through the board.
IPC-9708 provides three test methods to characterize the pad cratering of a component and PCBA: pin pull, ball pull, and ball shear testing. [5] In the pin pull test a pin is soldered to pads and pulled until fracture. It is a useful test for all pad geometries and is sensitive to board design and materials.
IPC TM-650 2.6.25 provides a test method to assess CAF susceptibility. [1] Additionally, IPC TM-650 2.6.16 provides a pressure vessel test method to rapidly evaluate glass epoxy laminate integrity. [6] This is helpful but it may often be better to use design rules and proper material selection to proactively mitigate the issue.