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I/O processor interconnection: remote procedure call over a serial link, DMA controller for bulk transfer Main RDRAM memory bus. Bandwidth: 3.2 GB/s; Graphics interface (GIF), DMA channel that connects the EE CPU to the GS ("Graphics Synthesizer") co-processor.
1 Power Processor Element (Primary), 8 Synergistic Processing Units (Secondary) Threads ? ? ? Clock speed 33.9 MHz 294.9 MHz 299 MHz 3.2 GHz GPU Cores ? ? ? Threads ? ? ? Clock speed 53 MHz 147 MHz 550 MHz Ray tracing No Memory 2 MB System RAM 1 MB VRAM 32 MB System RAM 4 MB VRAM 256 MB XDRAM 256 MB VRAM 256 MB XDRAM 256 MB GDDR3 SDRAM
The PlayStation 4 technical specifications describe the various hardware components of the PlayStation 4 home video game console group. Multiple versions of this console have been released since the initial launch of the PlayStation 4, including the PlayStation 4 Slim and the PlayStation 4 Pro. Subsequent versions include changes to the ...
The PS3 uses the Cell microprocessor, which is made up of one 3.2 GHz PowerPC-based "Power Processing Element" (PPE) and six accessible Synergistic Processing Elements (SPEs). A seventh runs in a special mode and is dedicated to aspects of the OS and security, and an eighth is a spare to improve production yields.
The time to shop for Christmas gifts is now: Take advantage of these great Cyber Monday sales. (Ariel Skelley via Getty Images)
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