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Common features of Ryzen Z1 handheld APUs: Socket: FP7, FP7r2, FP8. All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. All the CPUs support 20 PCIe 4.0 lanes. Includes integrated RDNA 3 GPU. Fabrication process: TSMC 4 nm FinFET.
Common features of Ryzen Z1 handheld APUs: Socket: FP7, FP7r2, FP8. All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode. L1 cache: 64 KB (32 KB data + 32 KB instruction) per core. L2 cache: 1 MB per core. All the CPUs support 20 PCIe 4.0 lanes. Includes integrated RDNA 3 GPU. Fabrication process: TSMC 4 nm FinFET.
An AMD Ryzen 5 2600 Die shot of a Ryzen 3 1200. Zen series CPUs and APUs (released 2017) Summit Ridge Ryzen 1000 series (desktop) Whitehaven Ryzen Threadripper 1000 series (desktop) Raven Ridge Ryzen 2000 APU series with RX Vega (desktop & laptop) and Athlon APU series with Radeon Vega (desktop & laptop)
The Ryzen 7000 mobile series initially launched in September 2022 with the Ryzen 7020 Mendocino line of low-end Zen 2 ultra mobile processors. [ 78 ] In early 2023, the rest of the Ryzen 7000 mobile lineup was released, starting with Ryzen 7030, Ryzen 7035, and later Ryzen 7045 and Ryzen 7040 series processors.
As of 2019, AMD's Ryzen processors were reported to outsell Intel's consumer desktop processors. [185] At CES 2020 AMD announced their Ryzen Mobile 4000, as the first 7 nm x86 mobile processor, [vague] the first 7 nm 8-core (also 16-thread) high-performance mobile processor, and the first 8-core (also 16-thread) processor for ultrathin laptops ...
Zen 3 was released on November 5, 2020, [30] using a more matured 7 nm manufacturing process, powering Ryzen 5000 series CPUs and APUs [30] (codename "Vermeer" (CPU) and "Cézanne" (APU)) and Epyc processors (codename "Milan"). Zen 3's main performance gain over Zen 2 is the introduction of a unified CCX, which means that each core chiplet is ...