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The upper critical solution temperature (UCST) or upper consolute temperature is the critical temperature above which the components of a mixture are miscible in all proportions. [1] The word upper indicates that the UCST is an upper bound to a temperature range of partial miscibility, or miscibility for certain compositions only.
B-staging is a process that utilizes heat or UV light to remove the majority of solvent from an adhesive, thereby allowing a construction to be “staged”.In between adhesive application, assembly and curing, the product can be held for a period of time, without sacrificing performance.
Bonding at specific temperature, ambient pressure for specific amount of time; Post-bake/hard-cure to form solid BCB monomer layer; The wafers can be cleaned using H 2 O 2 + H 2 SO 4 or oxygen plasma. The cleaned wafers are rinsed with DI water and dried at elevated temperature, e.g. 100 to 200 °C for 120 min. [17]
The lower critical solution temperature (LCST) or lower consolute temperature is the critical temperature below which the components of a mixture are miscible in all proportions. [ 1 ] [ 2 ] The word lower indicates that the LCST is a lower bound to a temperature interval of partial miscibility, or miscibility for certain compositions only.
A bath of ice and water will maintain a temperature 0 °C, since the melting point of water is 0 °C. However, adding a salt such as sodium chloride will lower the temperature through the property of freezing-point depression. Although the exact temperature can be hard to control, the weight ratio of salt to ice influences the temperature:
Common powders cure at 200 °C (392 °F) object temperature for 10 minutes. In European and Asian markets, a curing schedule of 180 °C (356 °F) for 10 minutes has been the industrial standard for decades, but is nowadays shifting towards a temperature level of 160 °C (320 °F) at the same curing time.
Solvent bonding differs from adhesive bonding, because the solvent does not become a permanent addition to the joined substrate. [4] Solvent bonding differs from other plastic welding processes in that heating energy is generated by the chemical reaction between the solvent and thermoplastic, and cooling occurs during evaporation of the solvent ...
K b, the ebullioscopic constant, which is dependent on the properties of the solvent. It can be calculated as K b = RT b 2 M/ΔH v, where R is the gas constant, and T b is the boiling temperature of the pure solvent [in K], M is the molar mass of the solvent, and ΔH v is the heat of vaporization per mole of the solvent.