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A die is a specialized machine tool used in manufacturing industries to cut and/or form material to a desired shape or profile. Stamping dies are used with a press, [1] as opposed to drawing dies (used in the manufacture of wire) and casting dies (used in molding) which are not. Like molds, dies are generally customized to the item they are ...
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs ) through processes such as photolithography .
Doubled die (also known as hub doubling) is a term in numismatics used to refer to a duplication of design elements on a working die created due to a misalignment of the die or hub during the hubbing process. Strength of the doubling can vary from very slight and isolated to extreme and widespread.
Full-custom design is limited to ICs that are to be fabricated in extremely high volumes, notably certain microprocessors and a small number of application-specific integrated circuits (ASICs). As of 2008 the main factor affecting the design and production of ASICs was the high cost of mask sets (number of which is depending on the number of IC ...
An engine block with aluminum and magnesium die castings. Die casting is a metal casting process that is characterized by forcing molten metal under high pressure into a mold cavity. The mold cavity is created using two hardened tool steel dies which have been machined into shape and work similarly to an injection mold during the process.
In CPU fabrications, a die shrink always involves an advance to a lithographic node as defined by ITRS (see list). For GPU and SoC manufacturing, the die shrink often involves shrinking the die on a node not defined by the ITRS, for instance, the 150 nm, 110 nm, 80 nm, 55 nm, 40 nm and more currently 8 nm nodes, sometimes referred to as "half-nodes".
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