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The PS3 supports both the USB EyeToy camera/webcam and SOCOM Headset for video and voice chat. A memory card adapter is available so users can copy their old PS/PS2 game saves to a virtual memory card on the PS3's hard drive. [55] The PlayStation 3 can also use Memory Sticks to store and save data for PlayStation and PlayStation 2 software. [56]
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
A 120 GB Slim model Motorized slot-loading disc cover. This feature is absent in the Super Slim model. The redesigned version of the PlayStation 3 (commonly referred to as the "PS3 Slim" and officially branded "PS3") features an upgradeable 120 GB, 160 GB, [25] [26] 250 GB or 320 GB [25] [26] hard drive and is 33% smaller, 36% lighter and consumes 34% (CECH-20xx) or 45% (CECH-21xx) less power ...
Technology magazine T3 gave the Super Slim model a positive review, stating the console is almost "nostalgic" in the design similarities to the original "fat" model, "While we don't know whether it will play PS3 games or Blu-ray discs any differently yet, the look and feel of the new PS3 Slim is an obvious homage to the original PS3, minus the ...
These thermal greases have low electrical conductivity and their volume resistivities are 1.5⋅10 15, 1.8⋅10 11, and 9.9⋅10 9 Ω⋅cm for 860, 8616 and 8617 respectively. The thermal grease 860 is a silicone oil with a Zinc Oxide filler and 8616 and 8617 are synthetic oils with various fillers including Aluminum Oxide and Boron Nitride.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).