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Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
The power supply on the "fat" model is 380 W. This was reduced to 250 W in the 120 GB "Slim" model. PS3 Slim models have labels indicating localized input requirements for power (120 V 60 Hz for North American and Japanese models and 220-240 V 50 Hz for European and Australian models), however teardowns have revealed the Slim power supplies are ...
These thermal greases have low electrical conductivity and their volume resistivities are 1.5⋅10 15, 1.8⋅10 11, and 9.9⋅10 9 Ω⋅cm for 860, 8616 and 8617 respectively. The thermal grease 860 is a silicone oil with a Zinc Oxide filler and 8616 and 8617 are synthetic oils with various fillers including Aluminum Oxide and Boron Nitride.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal adhesive or thermal paste improve the heat sink's performance by filling air gaps between the heat sink and the heat spreader on the device. A heat sink is usually made out of a material with a high thermal conductivity , such as aluminium or copper.