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Various examples of metal swarf, including a block of compressed swarf. Broken up chips are preferred over stringy drill chips. [1]Metal swarf, also known as chips or by other process-specific names (such as turnings, filings, or shavings), are pieces of metal that are the debris or waste resulting from machining or similar subtractive (material-removing) manufacturing processes.
A means had to be provided, of course, to put the initial charge of water into the boiler (before steam power was available to operate the steam-powered feedwater pump). The pump was often a positive displacement pump that had steam valves and cylinders at one end and feedwater cylinders at the other end; no crankshaft was required.
A spiral pump, sometimes called a Wirz pump or incorrectly Wirtz pump, is a low lift pump which is composed of a long piece of metal plating, which is wound into a coil and sealed at the top and back extremities so as to resemble a cylinder. The outer cavity serves as the inlet, while the inner (partial) tube serves as the outlet.
Leaded chip carriers have metal leads wrapped around the edge of the package, in the shape of a letter J. Leadless chip carriers have metal pads on the edges. Chip carrier packages may be made of ceramic or plastic and are usually secured to a printed circuit board by soldering, though sockets can be used for testing.
The inchworm motor uses piezoelectric ceramics to push a stator using a walking-type motion. These piezoelectric motors use three groups of crystals—two 'locking', and one 'motive' that permanently connects to either the motor's casing or stator (not both). The motive group, sandwiched between the other two, provides the motion.
The same inductive pump technology can be applied to very small pumps delivering volumes in the micro-liter range to much larger pumps delivering volumes in the 10 gallon per minute range. Understanding of magnetic field propagation has led to increased design simplicity which is a hallmark of inductive pumps.
Different types of pumps are suitable for different applications, for example: a pump's maximum lift height also determines the applications it can be used for. Low-lift pumps are only suitable for the pumping of surface water (e.g., irrigation, drainage of lands, ...), while high-lift pumps allow deep water pumping (e.g., potable water pumping ...
A thermal copper pillar bump, also known as a "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA).