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  2. Meat thermometer - Wikipedia

    en.wikipedia.org/wiki/Meat_thermometer

    A meat thermometer with various cooking temperatures denoted for various meat types. The probe can be inserted into the meat before starting cooking, and cooking continued until the desired internal temperature is reached. Alternatively the meat can be cooked for a certain time and taken out of the oven, and the temperature checked before serving.

  3. Smoke ring (cooking) - Wikipedia

    en.wikipedia.org/wiki/Smoke_ring_(cooking)

    A smoke ring is a region of pink colored meat in the outermost 8-10 millimeters of smoked meats. [1] It is usually seen on smoked chicken, pork, and beef. There is some debate as to whether or not the presence of the smoke ring is actually an indicator of quality of the finished barbecue product but it is widely considered to be a desirable ...

  4. Infrared thermometer - Wikipedia

    en.wikipedia.org/wiki/Infrared_thermometer

    Infrared scanning systems scan a larger area, typically by using what is essentially a spot thermometer pointed at a rotating mirror. These devices are widely used in manufacturing involving conveyors or "web" processes, such as large sheets of glass or metal exiting an oven, fabric, and paper, or continuous piles of material along a conveyor belt.

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  6. Wireless identification and sensing platform - Wikipedia

    en.wikipedia.org/wiki/Wireless_Identification...

    A wireless identification and sensing platform (WISP) is an RFID (radio-frequency identification) device that supports sensing and computing: a microcontroller powered by radio-frequency energy. [1] That is, like a passive RFID tag, WISP is powered and read by a standard off-the-shelf RFID reader, harvesting the power it uses from the reader's ...

  7. Non-contact wafer testing - Wikipedia

    en.wikipedia.org/wiki/Non-contact_wafer_testing

    Using mechanical probes has certain drawbacks: mechanical probing can damage the circuits under the probe pad on the IC [1] repeated probing can damage the probe pad on the IC, making further probing of that IC impossible; the probe card may be damaged from repeated contact, or become contaminated with debris created by contact with the wafer [2]